IEMAI 3D printer MAGIC-HT-MAX

● PrinterOverview
IEMAI high-performance material 3D printer MAGIC-HT-MAX is a 3D printing device based on the principle of fuse deposition (FFF) technology. It has a printing temperature of up to 500 ° C, a hot-bed temperature of180°C,and150°Cheatedchamber.
The temperature of the chamber supports most of the polymer 3D printing materials on the market, including special engineering plastics PEEK, PPSU, ULTEM, PC, etc., with a detachable dual print head (independentlifting),creatingconditionsforeasymaintenance.ItiscompatiblewithPLAandwater-soluble support material (PVA), ABS and limonene-based support material (HIPS), and also supports high-temperaturesupportprintingofspecialengineeringmaterialsPEEK,PEI,andPPSU.
IEMAI produces PEEK, PPSU, PEI and high-temperature cleaning materials. Together with the 3D printer MAGIC-HT-MAX/PRO/L/M, it became a domestic manufacturer to provide high-performance materials for 3D printed filament and high-temperature 3D printers,and solve the problem of cleaning and supporting high-performancematerials.
Core Parameters Core Functions
● Large Build Volume:500*500*700 mm
● High Printing Temperature:Up to 500℃
● High Chamber Temperature:Up to 150℃
● Build PlateTemperature:Up to 180℃
● Consumable case drying temperature: 70 ℃
● Humidity of moisture-proof cabinet >10-15%
● Quick-release liquid-cooled dual extruder
(independent lifting)
● Power Failure Recovery
● Filament Absent Warning, Wi-Fi Control
● Auto leveling system
● Automatic nozzle cleaning

Forming process:FFF Build volume:500x500x700 mm
Product size:1080*1380*1950mm Packing size :120*150*219cm
Maximum print temperature: 500℃ Maximum chamber temperature:150℃
Maximum hotbed temperature:180℃ Platform fixation:Vacuum Adsorption
Equipment net weight:750kg Packaging weight:850kg
Extruder quantity: Dual independent lifting extrude
r
Nozzle diameter: 0.2,0.4,0.6,0.8 and more
Printing speed:0-150mm/s File class:STL、GCODE、OBJ、3MF...
Materials:PEEK, PEKK,CFR PEEK,ULTEM, PPSU, metal,
PC, PA, ABS, ASA, PETG, HIPS, TPU, PLA, PVA...
Filament diameter:Standard 1.75mm Filament
(Open Material System)
Layer thickness:0.05-0.5 mm Positioning accuracy:X/Y12.5μm Z:6.25μm
Power Supply:220V,50~60Hz, 4500W
Software:IEMAI3D (Compatible with other
slicing software,like CURA、SIMPLIFY3D...)
Connection mode:SD card, USB,WIFI
Warranty:12 months
(except on consumables)
Consumable case drying temperature: 70 ℃ Humidity of moisture-proof cabinet >10-15%
Vaccum pump packing weight: 140KG Vaccum pump packing size: 1081*49*98c

 

 

 

    ₹4,000,000.00Price